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Inlay Board Product List and Ranking from 5 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jul 15, 2026～Aug 11, 2026
This ranking is based on the number of page views on our site.

Inlay Board Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 15, 2026～Aug 11, 2026
This ranking is based on the number of page views on our site.

  1. シグナス Kyoto//Electronic Components and Semiconductors
  2. 三和電子サーキット Osaka//Electronic Components and Semiconductors
  3. アーセルデザイン Kyoto//Electronic Components and Semiconductors
  4. 松和産業 本社 Mie//Electronic Components and Semiconductors
  5. 大陽工業 プリント回路カンパニー Saitama//Electronic Components and Semiconductors
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Inlay Board Product ranking

Last Updated： Aggregation Period:Jul 15, 2026～Aug 11, 2026
This ranking is based on the number of page views on our site.

  1. Thick copper substrate / copper inlay substrate シグナス
  2. High thermal conductivity substrate "Copper Inlay Substrate" *Includes comparison materials for thermal dissipation state. 三和電子サーキット
  3. Copper inlay substrate アーセルデザイン
  4. Copper inlay substrate 松和産業 本社
  5. Achieving high-density implementation and high heat dissipation. New possibilities with copper inlay substrates. 三和電子サーキット

Inlay Board Product List

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Thick copper substrate / copper inlay substrate

Thick copper substrate / copper inlay substrate

Outer layer maximum 762μm, inner layer 381μm. Compatible with copper inlay and copper core. For EV chargers and power semiconductors.

We provide thick copper substrates for applications requiring high current and high heat dissipation, such as EV (electric vehicle) chargers, power semiconductors, and power supply equipment. We support outer layer copper foil thicknesses up to 762μm and inner layers up to 381μm. We also accommodate copper inlays (embedded metal from 1.0 to 3.0mm) and copper core substrates, achieving high current and high voltage resistance. We have a track record of manufacturing substrates for electric vehicle chargers, including 12-layer t=5.0mm boards with 3.0mm copper inlays. It is also possible to combine T-type copper coin embedding with high-frequency compatible materials and create composite structures with rigid FPCs.

  • Circuit board design and manufacturing
  • Inlay Board

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Achieving high-density implementation and high heat dissipation. New possibilities with copper inlay substrates.

Achieving high-density implementation and high heat dissipation. New possibilities with copper inlay substrates.

In the era of IoT, we propose the use of copper inlay substrates and metal-based substrates for heat dissipation solutions, as well as ultra-thin substrates to enhance design flexibility for product miniaturization and thinness.

We solve your heat-related issues with Sanwa Electronics Circuit's heat dissipation substrates. In IoT devices such as 5G, the heat generation of components is increasing, and due to higher density, fanless structures are required, necessitating effective heat dissipation in limited areas. LED lighting also generates more heat with increased brightness, making it essential to efficiently dissipate heat. Additionally, there is a demand for integration into limited spaces and for designs that accommodate specific shapes. 【Products Offered】 ■ Copper Inlay Substrates - By embedding copper coins into the substrate, efficient heat dissipation to the backside is possible. - Various diameters of copper coins are always in stock. ■ Metal Base Substrates - Single-sided boards made of aluminum or copper are available. - Our technology allows for double-sided boards to be affixed with heat dissipation sheets. ■ Bendable Aluminum Substrates - Thin aluminum base substrates with a thickness of 0.40mm can be shaped by bending. - The use of flexible resins and aluminum allows for the maintenance of bent shapes. ■ Thin Rigid Substrates - We can accommodate incredibly thin double-sided rigid substrates down to 0.04mm. *For more details, please feel free to contact us. Our sales representatives will provide you with an explanation right away.

  • Printed Circuit Board
  • Inlay Board

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Copper inlay substrate

Copper inlay substrate

A high-current, high-heat-dissipation substrate that achieves effective heat dissipation!

The "copper inlay substrate" is used in a wide range of fields and is particularly adopted as a critical component related to human life in automotive applications, being a high-current and high-heat-dissipation substrate. It achieves an excellent cost-performance heat dissipation method. By pressing copper directly beneath heat-generating components, it effectively dissipates heat. Additionally, eliminating the need for screw fastening for each heat-generating component enhances reliability, reduces costs, and decreases assembly labor. 【Features】 ■ Compared to aluminum heat dissipation substrates, the lower coefficient of thermal expansion of copper improves the reliability of solder joints. ■ Compared to aluminum heat dissipation substrates, it allows for the use of high multilayer substrates and double-sided mounted substrates, increasing design flexibility. ■ Increased circuit efficiency due to greater freedom in component placement. ■ Miniaturization. ■ Both SMD and lead components can adopt the same heat dissipation structure. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Inlay Board

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Copper inlay substrate

Copper inlay substrate

By directly contacting heat-generating components with copper, which has a high thermal conductivity, excellent heat dissipation is achieved!

We would like to introduce the "Copper Inlay Substrate" handled by Matsuwa Sangyo Co., Ltd. This substrate is designed to partially improve heat dissipation characteristics by using copper pins pressed directly under heat-generating components. By making direct contact with heat-generating components, it achieves high heat dissipation due to the high thermal conductivity of copper. Compared to metal-based substrates, it can reduce weight, and it is also advantageous that the existing layer structure of substrates can be applied as is. 【Features】 ■ A substrate aimed at partially improving heat dissipation characteristics ■ Achieves high heat dissipation by making direct contact with heat-generating components using high thermal conductivity copper ■ Reduces weight compared to metal-based substrates ■ Existing layer structures of substrates can be applied as is *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Inlay Board

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High thermal conductivity substrate "Copper Inlay Substrate" *Includes comparison materials for thermal dissipation state.

High thermal conductivity substrate "Copper Inlay Substrate" *Includes comparison materials for thermal dissipation state.

We offer a substrate embedded with copper coins to efficiently dissipate heat.

Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Inlay Board

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Copper inlay substrate

Copper inlay substrate

Copper inlay substrate

By pressing copper directly under the heat-generating component, a significant heat dissipation effect can be achieved.

  • others
  • Inlay Board

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